| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum treatment system and a vacuum treatment method for uniformly treating a cylindrical substrate with plasma. SOLUTION: A substrate holding member 12 comprises a holding member 31 on which one end of a cylindrical substrate 5 is mounted and held, and an auxiliary member 32 which holds the other end of the cylindrical substrate 5 mounted on the holding member 31. In a reaction vessel 11, at least part of a top plate 22 confronted with the auxiliary member 32 consists of an electrically conductive material. Then, the auxiliary member 32 is formed into a shape in which the distance between the inside face of the top plate 22 and the counter face of the auxiliary member 32 gradually widens as the separation from the axis of the cylindrical substrate 5 in a radial direction becomes greater. COPYRIGHT: (C)2004,JPO
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