METHOD OF FORMING EMBEDDED WIRING

摘要

PROBLEM TO BE SOLVED: To uniform the surface height of an embedded wiring by suppressing erosion occurring in an area with dense embedded wiring and dishing occurring in an area of wide wiring width of the embedded wiring. SOLUTION: A recessed groove 41 for wiring of small width and a recessed groove 42 for wiring of large width are formed in an insulating film 31, a barrier layer 32 and a copper film 33 are deposited on the insulating film 31, and the copper film 33 is subjected to reflow. Chemical-mechanical polishing is performed on the copper film 33 while feeding polishing slurry containing copper ions on a polishing pad. Negative voltage is applied to the copper film 33 to deposit a copper-plated layer 43 on the surface of the copper film 33 while continuing the chemical-mechanical polishing of the copper film 33. The surface height of the copper film 33 deposited on the recessed groove 41 for wiring of small width and the recessed groove 42 for wiring of large width is set to be substantially equal to the surface height of a projecting portion 31a of the insulating film 31. COPYRIGHT: (C)2004,JPO