METHOD AND APPARATUS FOR SUPPORTING SEMICONDUCTOR WAFERS

摘要

A method and system for supporting semiconductor wafers during processing. A T-shaped support, when viewed in top-down cross-section, has a relatively large, semicircular portion at one end, tapering to a series of relatively thin ledges. In side-view cross-section, the ledges are uniformly spaced along the length of the T support. The top of each ledge contacts the semicircular portion at an angle slightly greater than ninety degrees. One or more T-rails may be used in a wafer carrier. The wafer carrier typically accepts and supports one or more semiconductor wafers for thermal processing inside the process chamber, without binding the wafers or causing undue markings on the wafers' surfaces.