| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To speed up inspection in a device inspecting a defect, foreign matter, residue, and the like of the same design pattern on a wafer in a manufacturing process of a semiconductor device by means of an electron beam. <P>SOLUTION: The surface of a semiconductor specimen 7 is irradiated with an electron beam (area beam) having a fixed area, a reflected electron from the specimen surface is focused by an image focusing lens 11, and images of a plurality regions on the semiconductor specimen 7 surface are obtained to be stored in image storage parts 18 and 19. When a plurality of the stored area images are compared mutually, presence/absence and the position of a defect in the areas can be determined. <P>COPYRIGHT: (C)2004,JPO</p> |
