| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a thin plate having a good shape without unevenness of thickness and a strainless good crystal structure by uniforming the temperature distribution of the main surface of a substrate where the thin plate is formed. <P>SOLUTION: The thin plate is manufactured by dipping the substrate 1 having the surface for the thin plate growth in a melt 17 and growing the thin plate on the surface for the thin plate growth by solidification, where the substrate dipping process to dip at least a part of the surface for the thin plate growth in the melt 17 and the substrate taking-out process to take out the surface for the thin plate growth from the melt 17 are contained. These processes for dipping the substrate and taking it out are done by rotating the substrate 1. <P>COPYRIGHT: (C)2004,JPO</p> |
