发明名称 WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To make sufficiently securable the rigidity of a rigid area while sufficiently securing the flexibility of a flexible area, to advance the manufacturing of a wiring board by using a member in a state in which a reinforcing plate having rigidity occupies the whole wiring board area as a base, and to improve the fineness and formation accuracy of a wiring film formed in the rigid area. <P>SOLUTION: A material obtained by selectively removing a reinforcing plate 16 having rigidity is used as a base, a wiring film 20 is formed so as to be extended from the reinforcing plate 16 of the base up to the part from which the reinforcing plate 16 is removed, a part occupying the part from which the reinforcing plate 16 is removed in the wiring film 20 is made to be a flexible part, and electronic components 28a, 28b are made to be mounted in the portions of the wiring film 20 of which the rigidity is reinforced by the reinforcing plate 16. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004153123(A) 申请公布日期 2004.05.27
申请号 JP20020318159 申请日期 2002.10.31
申请人 NORTH:KK;SANTA KEIKINZOKU KOGYO KK 发明人 OSAWA KENJI;ENDO KIMIYOSHI;NAGASAKA TARO;IIJIMA ASAO;YODA SHOICHI
分类号 H05K1/11;H05K1/02;H05K3/40;H05K3/46;(IPC1-7):H05K1/02 主分类号 H05K1/11
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