| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board wherein adhesive strength between a wiring conductor and an insulating layer is improved, exfoliation due to thermal hysteresis is not generated when an electronic component such as a semiconductor element and a resistor is mounted on a wiring board, and connection reliability is superior. <P>SOLUTION: The wiring board is constituted by laminating a plurality of numbers of circuit boards 3. In the circuit board 3, the wiring conductor 2 formed of a metal foil is embedded in the insulating layer 1 wherein heat-resistant fibrous base material is impregnated with thermosetting resin, in such a manner that a surface of the wiring conductor 2 makes almost the same surface as a surface of the insulating layer 1. In the wiring conductor 2, both main surfaces 2a are mat surfaces whose arithmetic average roughness is 1-2μm, and both side surfaces 2b are coarsening surfaces whose arithmetic average roughness is 0.1-0.5μm. <P>COPYRIGHT: (C)2004,JPO</p> |
