| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer circuit board which is capable of efficiently manufacturing the multilayer circuit boards through simple manufacturing equipment. <P>SOLUTION: A circuit pattern is formed inside a rectangular laminate 1 composed of a plurality of laminated dielectric layers, a cutout 2 is provided on the surface of the laminate 1 so as to be open at its end faces, and an electronic part element 3 electrically connected to the circuit pattern is mounted on the surface of the dielectric layer exposed in the region where the cutout 2 is provided to form the multilayer circuit board 10. The rectangular laminate 1 of the multilayer circuit board 10 is formed through a process 1 of forming a large-scale laminate 20 provided with a plurality of board regions corresponding to the rectangular laminate 1 and continuously providing recesses 6 corresponding to the cutout 2 to the board regions of the large-scale laminate 20, so as to enable the recesses 6 to straddle a space between the adjacent board regions and another process 2 of dividing the large-scale laminate 20 along the boundaries 5 between the board regions into the rectangular laminates 1. <P>COPYRIGHT: (C)2004,JPO</p> |
