发明名称 ELECTRONIC EQUIPMENT PACKAGE AND INJECTION MOLDING APPARATUS USED FOR FABRICATING THE PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide an injection molding apparatus capable of relaxing directivity of a fiber in a fiber reinforced resin flowing into a cavity. SOLUTION: The injection molding apparatus injection-fills a molding material 2 obtained by mixing a fibrous reinforcing material with a base material made of a resin into the cavity 33' to mold. In the injection molding apparatus 3' used for an injection molding method to obtain a molded body 1, the cavity 33' includes a gate part 330 which is an inflow port to feed the molding material 2 into the cavity 33' and a plurality of overflow parts 332'. One of the overflow parts 332' is provided in a first direction against the gate part 330 and also another at least one of the overflow parts 332' is provided in a second direction crossing the first direction. Therefore, directivity of the fibrous reinforcing material is relaxed and increase in characteristic anisotropy in the formed body 1 can be suppressed. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004148773(A) 申请公布日期 2004.05.27
申请号 JP20020319423 申请日期 2002.11.01
申请人 FUJITSU LTD 发明人 ISHIZUKA MASANOBU
分类号 B29C45/37;B29K105/08;B29L31/34;(IPC1-7):B29C45/37 主分类号 B29C45/37
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