| 摘要 |
PROBLEM TO BE SOLVED: To obtain a system for filling holes on the surface of a printed wiring board with resin easily without using a mimeograph machine, or the like. SOLUTION: In the method for filling holes on the surface of a printed wiring board 8 with high viscosity liquid resin 7a in vacuum, a nozzle 2 for jetting the high viscosity liquid resin 7a is disposed closely above the printed wiring board and a spreading member is disposed in contact with the printed wiring board in the vicinity of the jet nozzle. While jetting a specified quantity of high viscosity liquid resin from the nozzle, the nozzle 2 and the spreading member are moved in parallel with the printed wiring board and the high viscosity liquid resin is spread by the spreading member substantially simultaneously with jetting thereof. Consequently, the holes on the surface of the printed wiring board can be filled with resin easily without using a mimeograph machine, or the like. COPYRIGHT: (C)2004,JPO
|
