| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polyimide resin which contains thermosetting groups, hence provides a cured film with excellent heat resistance, mechanical strengths, solvent resistance and adhesion to various materials by a low-temperature, short-time heat treatment, and is excellent in transparency in a visible light region and soluble in a solvent. SOLUTION: A thermosetting transparent polyimide silicone resin soluble in an organic solvent and comprising structural units represented by formula (1) and structural units represented by formula (4) is provided. In formulas (1) and (4), X denotes a 4C or higher tetravalent organic group provided that a plurality of -CO- groups are not bonded to one of the carbon atoms of X; Y denotes a diamine residue containing a phenyl group; and Z denotes a diaminosiloxane residue. COPYRIGHT: (C)2004,JPO
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