发明名称 |
Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices |
摘要 |
A substrate sheet material for semiconductor device and manufacturing method thereof and a manufacturing method of a semiconductor device using the substrate sheet material can suppress and reduce a warp which may occur in the substrate sheet material even when a plurality of semiconductor chips formed in the substrate sheet material are molded all at once. A plurality of substrates to be used for producing semiconductor packages are formed in the substrate sheet material. An outer configuration of the substrate sheet material is made into a circular shape.
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申请公布号 |
US2004099943(A1) |
申请公布日期 |
2004.05.27 |
申请号 |
US20030718677 |
申请日期 |
2003.11.24 |
申请人 |
FUJITSU LIMITED |
发明人 |
MEGURO KOUICHI;NISHINO TORU;HAYASAKA NOBORU |
分类号 |
H01L21/48;H01L21/56;H01L23/31;(IPC1-7):H01L23/28;H01L23/48;H01L21/44;H01L21/50;H01L29/40 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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