发明名称 A PROBE FOR COMBINED SIGNALS
摘要 <p>A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-­under-test over a signal path that avoids the impedance matching resistor.</p>
申请公布号 WO2004044604(A1) 申请公布日期 2004.05.27
申请号 WO2003US34261 申请日期 2003.10.28
申请人 US;US;US;US 发明人 HAYDEN, LEONARD;RUMBAUGH, SCOTT;ANDREWS, MIKE
分类号 G01R1/067;(IPC1-7):G01R31/02 主分类号 G01R1/067
代理机构 代理人
主权项
地址