发明名称 |
A PROBE FOR COMBINED SIGNALS |
摘要 |
<p>A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a signal path that avoids the impedance matching resistor.</p> |
申请公布号 |
WO2004044604(A1) |
申请公布日期 |
2004.05.27 |
申请号 |
WO2003US34261 |
申请日期 |
2003.10.28 |
申请人 |
US;US;US;US |
发明人 |
HAYDEN, LEONARD;RUMBAUGH, SCOTT;ANDREWS, MIKE |
分类号 |
G01R1/067;(IPC1-7):G01R31/02 |
主分类号 |
G01R1/067 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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