| 摘要 |
PURPOSE: A method for lead junction in a process for fabricating a multi-chip package is provided to prevent a defect of a plating layer formed on a surface of a lead, enhance a junction characteristic of a junction part between leads, and reduce the amount of solder. CONSTITUTION: A method for lead junction in a process for fabricating a multi-chip package includes a process for bonding leads(215,225) connected to semiconductor chips(210,220) to leads of other semiconductor chips. A solder paste(280) is coated on a junction part between the leads. The solder paste is melt by heating the junction part between the leads. The leads are bonded each other by solidifying the melted solder paste. The multi-chip package is formed with a dual die package including two semiconductor chips. A plating layer is formed on a surface of the leads. The melting temperature of the solder paste is lower than the melting temperature of the plating layer of the lead surface.
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