| 摘要 |
PROBLEM TO BE SOLVED: To provide a deburring device for a lead frame in which a cost is reduced while a laser beam irradiating unit to be used is quit for one, and an additional element of a laser optical system and assembly adjustment for the optical system is not needed. SOLUTION: A lead frame 1 comprising a semiconductor mold chip 3 is transported. By irradiating with a laser beam L along the periphery of the semiconductor mold chip 3, a resin burr 6 is fusion-cut and removed. A transport channel for the lead frame 1 comprises: an approach route 18a and a return route 18b for beam irradiation arranged side-by-side on almost the same plane; and an inverting means 20 which inverts the lead frame 1 transported from the approach route 18a for beam irradiation toward the return route 18b. By irradiating with the laser beam L from one direction to the approach route 18a and the return route 18b for beam irradiation, the resin burr 6 on the front side of the lead frame 1 is removed on the approach route 18a for beam irradiation, and the resin burr 6 on the rear side of the lead frame 1 is removed on the return route 18b. COPYRIGHT: (C)2004,JPO
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