| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly precise resist sensitivity measuring method which can be applied to variety, and which can be monitored even by a product wafer. SOLUTION: This aligner control method comprises a step for exposing the different areas of a substrate coated with a light sensitive agent with different exposures, a step for measuring film thickness change during the development of the light sensitive agent on the substrate, a step for searching developing speed change with respect to the exposures from the film thickness change of each of the different exposures, a step for calculating the exposure for obtaining the desired line width of a circuit pattern from the developing speed change, the circuit pattern, the wave front aberration of the exposure lens, a light source image shape on the exposure lens pupil face, the developing time, and the film thickness of the light sensitive agent and a step for feeding back the exposure to the aligner. COPYRIGHT: (C)2004,JPO
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