| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink device capable of absorbing a large amount of heat by a heat receiving part which can be installed in correspondence to a small heating element with a large calorific value, or in corresponce to miniaturization of an electronic apparatus or the like housing the heating element. SOLUTION: The heat sink device has the heat receiving part 104 absorbing heat from the heating element 105, a transfer part 106 transferring the heat absorbed by the heat receiving part 104, and a heat sink part 107 radiating the heat. The heat receiving part 104, the transfer part 106, and the heat sink part 107 are provided on a plurality of plate type small diameter heat pipes 101, 102, and 103. The plurality of small diameter heat pipes have a plurality of small diameter tunnels sealing a predetermined amount of working fluid, and the working fluid blocks the small diameter tunnel by its surface tension to transfer heat. Flat faces of the heat receiving parts 104 of the plurality of small diameter heat pipes are lapped. COPYRIGHT: (C)2004,JPO
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