发明名称 |
VALVE GATE TYPE MOLD ASSEMBLY |
摘要 |
PROBLEM TO BE SOLVED: To provide a valve gate type mold assembly capable of reducing the temperature difference of the molding material in the material passage of a valve device. SOLUTION: The valve pin 36 for opening and closing a gate 6 is allowed to pierce through the material passage 8 of the casing 2 of the valve body 1 having a heater 9 provided to the outer peripheral part thereof. A low heat conductive member 34 is provided to the intermediate part in the axial direction of the casing 2 while a low heat conductive members 35 are provided to both end parts of the casing 2, and the heater 9 is densely wound around both end parts and coarsely wound around the intermediate part from the outsides of the heat conductive members. Since the heat of the heater 9 is hard to transmit to both end parts at the intermediate part, the intermediate part in the axial direction of the casing 2 develops a tendency not to transmit heat energy as compared with both end parts and the heat radiation from both end parts caused by the contact of the casing 2 with a fixed template 3 at both end parts is set off to reduce the temperature difference of the resin in the material passage 8 of the casing 2. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004148551(A) |
申请公布日期 |
2004.05.27 |
申请号 |
JP20020313521 |
申请日期 |
2002.10.28 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
MURAYAMA FUJIO;TAKEISHI ATSUSHI |
分类号 |
B29C45/28;B29C45/73;(IPC1-7):B29C45/28 |
主分类号 |
B29C45/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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