| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solar cell device which restrains solder bridges or balls from being produced when electrodes are covered with solder and can be exposed to a high temperature of 200°C or above in an after process, and to provide its manufacturing method. <P>SOLUTION: Different conductive regions are formed on the one main and other main surface of a semiconductor substrate 1 respectively, electrode material is fixed on the one surface of the substrate 1 by baking to form a surface electrode 5 composed of a bus bar 5a and a finger 5b, and a back electrode 4 is formed on the other main surface of the substrate 1 for the formation of the solar cell device. The electrodes 4 and 5 are covered with solder. After the electrode material is baked on the one main surface of the substrate 1, paste mainly formed of glass is applied on a part of the region where the electrode material is baked and burned, and the region where the electrode material is baked is coated with the solder 7. <P>COPYRIGHT: (C)2004,JPO</p> |
