| 摘要 |
PROBLEM TO BE SOLVED: To prevent the damage of bath stability, to further secure uniformity even to the object to be plated low in chemical resistance so as to prevent unevenness in precipitation, and to form a gold film having satisfactory denseness, desired solder wettability and excellent adhesion. SOLUTION: A nickel film 8 is formed on a copper electrode 7 formed on the surface of a glass ceramic substrate 6., and a gold film 9 is formed on the nickel film 8. Then, a gold plating liquid used for the formation of the gold film 9 comprises (1) a non-cyano-gold source, (2) sulfite as a complexing agent for gold, (3) aminocarboxylic acids as a stabilizer for gold, (4) oxycarboxylic acids as a masking reagent, (5) an antimony compound and/or a bismuth compound as a precipitation promotor, and (6) a thiol compound or the derivative thereof and/or a nitrogen-containing heterocyclic compound as a precipitation control agent. COPYRIGHT: (C)2004,JPO
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