| 摘要 |
PROBLEM TO BE SOLVED: To reduce the occurrence of warp regardless of a difference between the thermal expansion coefficients of a heat sink and an article from which heat is dissipated, and to suppress lowering of thermal conductivity. SOLUTION: A low thermal expansion material 18 is placed on the body 17 of a heat sink 16. The heat sink body 17 is formed of a so-called high thermal conductivity material, e.g. Al or Cu, and the low thermal expansion material 18 is formed of a material having a thermal expansion coefficient lower than that of the heat sink body 17, e.g. Invar. A plurality of holes 19 are made through the low thermal expansion material 18. The holes 19 being made in a region of the low thermal expansion material 18 corresponding to an insulating substrate 11 are increased in number whereas the holes 19 being made in the peripheral region thereof are decreased in number and increased in cross-sectional area. COPYRIGHT: (C)2004,JPO |
