| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing method and a polishing apparatus, by which a workpiece having excellent surface quality is obtained by polishing the workpiece without chipping. <P>SOLUTION: When a side surface (cut-off end face) 21b of a cut-off groove of a workpiece (wafer) 21 having the cut-off groove 21a formed thereon is polished, first, the cut-off groove 21a is formed on the wafer 21. And then, a polishing wheel 27 having the width smaller than the cut-off groove 21a is inserted into the cut-off groove 21a by moving at least one of the wafer 21 or the polishing member (polishing wheel) 27. After that, one of main faces of the polishing wheel 27 is brought into contact with the cut-off end face 21b by moving at least one of the wafer 21 or the polishing wheel 27. And then, the cut-off end face 21b is polished by letting the polishing wheel 27 move along the cut-off groove 21a by moving at least one of the wafer 21 or the polishing wheel 27, and at the same time, by letting the polishing wheel 27 relatively move in the direction, that is perpendicular to the one main face of the polishing wheel 27, and is looking toward the one main face from the other main face (the direction of the thrust of a rotary spindle). <P>COPYRIGHT: (C)2004,JPO</p> |
