| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board which sufficiently endures against a thermal stress even when a long term heat history is repeated and which has high connecting reliability without bringing about a disconnection, etc. <P>SOLUTION: The wiring board is formed by alternately laminating a plurality of insulating layers 4 and wiring conductor layers 5 each made of plating on a surface of an insulating substrate 1 embedding a wiring conductor 2 of a core substrate 3 formed by embedding the wiring conductor 2 made of a metal foil, so that the surface of the conductor becomes in plane with the surface of the substrate 1 obtained by impregnating a heat resistant fiber base material with a thermosetting resin. In the wiring board, the core substrate 3 is formed by coating its surface with an elastic resin layer 8 coating a boundary 7 between the conductor 2 and the substrate 1. <P>COPYRIGHT: (C)2004,JPO</p> |
