| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To integrally manufacture a multilayer wiring board where two or above substrate main body parts are connected in a flexible wiring part and to improve productivity. <P>SOLUTION: The multilayer wiring board is composed of the right/left substrate main bodies in which insulating layers are laminated and which have conductor patterns 6 and the like and of the flexible wiring which electrically connects the substrate main bodies by a conductor pattern 9. An insulating layer of the flexible wiring is integrally connected to the insulating layers for three layers on lower sides in both substrate main bodies. The conductor pattern 9 is also integrally connected to the conductor patterns 6 of the substrate main bodies. For manufacturing the multilayer wiring board, the three layers on the lower sides of the substrate main bodies, three coupling base materials 10 being flexible wiring coupling the three layers and independent base materials 11 being five remaining layers in the substrate main bodies are manufactured by forming the conductor patterns 9 and 6 in films 16 and 12 formed of crystal transfer-type thermoplastic resin, which become the insulating layers. They are laminated and are integrated in a mold 17 by hot pressing. <P>COPYRIGHT: (C)2004,JPO</p> |
