| 摘要 |
PROBLEM TO BE SOLVED: To provide a power semiconductor device wherein a packaging area of a substrate on which a power module is attached is reduced and attaching is performed without applying stress to terminals. SOLUTION: The power semiconductor device 10 is provided with the substrate 1 and the power module 2. The power module has a power semiconductor element and is packaged in such a manner that a first end out of two ends of the periphery of a main surface of which the ends face each other faces the surface of the substrate, and the main surface is positioned vertically relative to the surface of the substrate. A terminal 7 for control and a power source terminal 8 which are led out of the first end of the power module are soldered to the substrate, and a terminal 6 for load connection is led out of the second end facing the first end. COPYRIGHT: (C)2004,JPO |
