| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant resin composition having excellent adhesiveness after heat deterioration, reducing the organic solvent content without causing environmental pollution and deterioration of the working environment and advantageous to hygienic sanitary aspects and to provide a coating comprising the resin composition as a coating film component. SOLUTION: The heat-resistant resin composition is obtained by compounding a polyamideimide resin prepared by reacting 1,5-naphthalene diisocyanate with an aromatic tribasic acid anhydride in (A) a basic polar solvent with (B) a basic compound and (C) water. The basic compound of the component (B) is characterized in that the basic compound is compounded in an amount of 1-20 equivalents based on the acid value of the total of carboxy groups contained in the polyamideimide resin of the component (A) and carboxy groups produced by ring opening of acid anhydride groups in the polyamideimide resin. COPYRIGHT: (C)2004,JPO
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