发明名称 |
Anisotroper und elektrisch leitender Klebstoff und Verbindungsverfahren |
摘要 |
An anisotropically electroconductive adhesive material is configured of a thermosetting resin and electroconductive particles dispersed in the thermosetting resin, wherein a 10% modulus of compressive elasticity (E) in the electroconductive particles and the modulus of longitudinal elasticity (E') of the projecting electrodes of the electronic element to be connected by the anisotropically electroconductive adhesive material satisfy the below relational Formula (1). <DF NUM="(1)">0.02 </= E/E' </= 0.5 </DF> |
申请公布号 |
DE60101175(T2) |
申请公布日期 |
2004.05.27 |
申请号 |
DE2001601175T |
申请日期 |
2001.03.28 |
申请人 |
SONY CHEMICALS CORP., TOKIO/TOKYO |
发明人 |
SUGA, YASUHIRO;TAKEICHI, MOTOHIDE |
分类号 |
C09J5/06;C09J9/02;C09J163/00;H01B1/20;H01B1/22;H01B5/16;H01L21/60;H01R11/01;H05K3/32;(IPC1-7):C09J163/00;H01L23/482 |
主分类号 |
C09J5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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