Multilayer ceramic substrate with internal connection part wider than external terminal

摘要

A ceramic multilayer substrate has internal connection parts 240 formed in the internal patterns 9 that are broad enough to surround the external terminal 220, and to stably achieve a connection between the internal patterns and the external terminal and maintain the connection even in the case of an error occurring in a step for forming a through hole on the substrate. The ceramic multilayer substrate comprises a plurality of ceramic substrates stacked vertically, pattern layers formed on surfaces of the ceramic substrates so as to form circuit elements; external terminals formed on side surfaces of the stacked ceramic substrates; and internal connection parts 240, each of which is formed on a part of the pattern layer, connected to the external terminal so as to exchange signals with the outside and being broad enough to surround the external terminal. In a modified embodiment (figs 3, 4) the internal connection part has a width greater than the terminal, but does not surround the terminal.