发明名称 |
SEMICONDUCTOR RADIATING SUBSTRATE AND PRODUCTION METHOD THEREFOR AND PACKAGE |
摘要 |
<p>In a semiconductor heat-dissipating substrate made of a Cu-W alloy whose pores have been infiltrated with copper, being a porous tungsten body whose pore diameter at a specific cumulative surface area of 95% is 0.3 mu m or more, and whose pore diameter at a specific cumulative surface area of 5% is 30 mu m or less, thermal conductivity of 210 W/m.K or more is obtained by decreasing the content of iron-family metal to be less than 0.02 weight %. Likewise, changing the amount of infiltrated copper in a molded object by utilizing a multi-shaft press to vary the amount of vesicles in the middle and peripheral portions makes for offering at low cost a semiconductor heat-dissipating substrate that in between middle and peripheral portions made of different materials does not have bonding matter. <IMAGE> <IMAGE> <IMAGE></p> |
申请公布号 |
EP1422757(A1) |
申请公布日期 |
2004.05.26 |
申请号 |
EP20020760732 |
申请日期 |
2002.08.23 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
TAKASHIMA, K.;YAMAGATA, S.;ABE, YUGAKU;SASAME, A |
分类号 |
H01L23/34;H01L23/36;B22F3/11;C22C1/04;H01L21/52;H01L23/373;H01L23/40;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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