COMPRESSION BONDED SEMICONDUCTOR DEVICE

摘要

In order to provide a compression bonded type semiconductor device which is used as a large capacity inverter for driving a paper or steel making rolling mill and which is capable of simplifying works for attaching/removing a GCT to a gate drive device, a second stack electrode (47) is extended below a connection section (38b) where an external gate terminal (38) and a plate-shaped control gate electrode (48) are electrically connected and there is disposed a support member (53) which is provided concentrically with the external gate terminal (38) between the connection section (38b) and the second stack electrode (47) and which has a second elastic body (54) which presses the connection section (38b).