发明名称 |
Copper electroplating bath |
摘要 |
Copper electroplating baths are provided containing as one or more suppressor compounds poly(alkylene oxide) random copolymers which are capable of providing copper filled sub-micron sized apertures free of pits and voids. Such copper electroplating baths are useful in the manufacture of electronic devices, such as printed wiring boards and integrated circuits.
|
申请公布号 |
EP1422320(A1) |
申请公布日期 |
2004.05.26 |
申请号 |
EP20030257256 |
申请日期 |
2003.11.18 |
申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
MIKKOLA, ROBERT D.;WANG, DEYAN;WU, CHUNYI |
分类号 |
C25D3/38;C25D7/06;C25D7/12;H01L21/288;H05K3/42;(IPC1-7):C25D3/38 |
主分类号 |
C25D3/38 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|