发明名称 |
METHOD AND DEVICE FOR MICROMACHINING A WORKPIECE BY MEANS OF LASER RADIATION |
摘要 |
The invention relates to a method for micromachining a workpiece (3), especially for producing a borehole in the workpiece (3), by means of ultrashort-pulse laser radiation. According to the invention, a sacrificial layer (7) is applied to a surface of the workpiece (3) in a fixed manner. Ultrashort laser pulses are then generated, said pulses penetrating the sacrificial layer (7) and removing material from the workpiece (3). The sacrificial layer (7) is removed once a sufficient amount of material has been removed from the workpiece (3). |
申请公布号 |
EP1420917(A1) |
申请公布日期 |
2004.05.26 |
申请号 |
EP20020769865 |
申请日期 |
2002.08.12 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
HANEBUTH, HENNING;KULL, EBERHARD;KAMLAGE, GUENTER |
分类号 |
B23K26/0622;B23K26/066;B23K26/073;B23K26/18;B23K26/382;B23K26/40 |
主分类号 |
B23K26/0622 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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