发明名称 METHOD AND DEVICE FOR MICROMACHINING A WORKPIECE BY MEANS OF LASER RADIATION
摘要 The invention relates to a method for micromachining a workpiece (3), especially for producing a borehole in the workpiece (3), by means of ultrashort-pulse laser radiation. According to the invention, a sacrificial layer (7) is applied to a surface of the workpiece (3) in a fixed manner. Ultrashort laser pulses are then generated, said pulses penetrating the sacrificial layer (7) and removing material from the workpiece (3). The sacrificial layer (7) is removed once a sufficient amount of material has been removed from the workpiece (3).
申请公布号 EP1420917(A1) 申请公布日期 2004.05.26
申请号 EP20020769865 申请日期 2002.08.12
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 HANEBUTH, HENNING;KULL, EBERHARD;KAMLAGE, GUENTER
分类号 B23K26/0622;B23K26/066;B23K26/073;B23K26/18;B23K26/382;B23K26/40 主分类号 B23K26/0622
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