发明名称 Embedding resin, wiring substrate using same and process for producing wiring substrate using same
摘要 An embedding resin for embedding an electronic part in a wiring substrate, includes at least one of a soluble resin and a soluble organic filler as a soluble component to be dissolved with an oxidizing agent.
申请公布号 US6740411(B2) 申请公布日期 2004.05.25
申请号 US20020042317 申请日期 2002.01.11
申请人 NGK SPARK PLUG CO. LTD. 发明人 KOJIMA TOSHIFUMI;TAKEUCHI HIROKI;OBAYASHI KAZUSHIGE
分类号 H01L21/68;H01L23/498;H05K1/18;(IPC1-7):B32B27/38 主分类号 H01L21/68
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