发明名称 |
Embedding resin, wiring substrate using same and process for producing wiring substrate using same |
摘要 |
An embedding resin for embedding an electronic part in a wiring substrate, includes at least one of a soluble resin and a soluble organic filler as a soluble component to be dissolved with an oxidizing agent.
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申请公布号 |
US6740411(B2) |
申请公布日期 |
2004.05.25 |
申请号 |
US20020042317 |
申请日期 |
2002.01.11 |
申请人 |
NGK SPARK PLUG CO. LTD. |
发明人 |
KOJIMA TOSHIFUMI;TAKEUCHI HIROKI;OBAYASHI KAZUSHIGE |
分类号 |
H01L21/68;H01L23/498;H05K1/18;(IPC1-7):B32B27/38 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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