发明名称 |
Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus |
摘要 |
The present invention provides a member for removing foreign matter adhering to the spherical tip portion of a test probe which is put into contact with the bonding pads of a semiconductor chip to test the action of the semiconductor chip. The member includes four essential layers of a base plate, a first elastic member on the base plate and flexibly deformable upon contact of the probe, specifically, a predetermined Young's modulus, a second elastic member on the first elastic member and having a tensile strength and a thickness responding to contact stress produced by the contact of the probe, and an abrasive layer on the second elastic member and made of hard particles and a binding material in a volume ratio providing a smooth sliding action of the probe and producing a high abrasive efficiency to any adhering foreign matter. The removing member can smoothly slide the probe to effectively remove the foreign matter adhering to the probe tip.
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申请公布号 |
US6741086(B2) |
申请公布日期 |
2004.05.25 |
申请号 |
US20020126982 |
申请日期 |
2002.04.22 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
MAEKAWA SHIGEKI;TAKEMOTO MEGUMI;KASHIBA YOSHIHIRO |
分类号 |
G01R31/26;B08B1/00;G01R1/06;G01R1/067;G01R3/00;H01L21/66;(IPC1-7):B08B1/00 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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