| 发明名称 |
Refrigeration cooling assisted MEMS-based micro-channel cooling system |
| 摘要 |
A refrigeration cooling assisted MEMS-based micro-channel cooling system that removes high heat densities generated by microelectronic components using a primary cooling system thermally coupled with a secondary chip embedded cooling system.
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| 申请公布号 |
US6741469(B1) |
申请公布日期 |
2004.05.25 |
| 申请号 |
US20030360345 |
申请日期 |
2003.02.07 |
| 申请人 |
SUN MICROSYSTEMS, INC. |
发明人 |
MONFARAD ALI HEYDARI |
| 分类号 |
H01L23/427;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/427 |
| 代理机构 |
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