| 摘要 |
A communication device and overmold adapted to minimize the feedback, acoustic coupling, and seismic vibration between a speaker and microphone in close proximity, as is typically found in hands-free headsets, is provided. This invention, through the use of specific structures absorbs unwanted noise and sound waves thereby improving the performance of the communication system as a whole. The complete system of this invention is provided in several embodiments, including an embodiment where the microphone is inserted within the overmold structure, an embodiment where the microphone is a boom microphone and an embodiment where the microphone is somewhat remote (a few inches) down from a miniaturized overmold and is provided with an ON/OFF switch.
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