发明名称 Apparatus and method for contacting a conductive layer
摘要 A structure and method for creating a contact between a conductive layer and a pad for dissipating electrostatic charges comprising the steps of, forming a pad and a composite insulating layer between and over conductive plates on a substrate, wherein the insulating layer isolates and protects the conductive plates and pad from damage, the insulating layer comprising a dielectric region underlying a conductive layer. A passivation layer is formed over at least a portion of the conductive layer and a photoresist is patterned over at least a portion of the passivation. An opening is etched through the passivation and the insulating layers, wherein the photoresist and the conductive layer serve as masks. Finally, a conductive material is deposited in the opening to form an electrical contact between the pad and the conductive layer.
申请公布号 US6740945(B2) 申请公布日期 2004.05.25
申请号 US20020175700 申请日期 2002.06.20
申请人 STMICROELECTRONICS, INC. 发明人 LEPERT ARNAUD YVES;THOMAS DANIELLE A.;DO-BENTO-VIEIRA ANTONIO A.
分类号 H01L27/04;A61B5/117;G01B7/28;G01B7/34;G06K9/00;G06T1/00;H01L21/822;(IPC1-7):H01L27/14 主分类号 H01L27/04
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