发明名称 |
Solder compositions for attaching a die to a substrate |
摘要 |
A method for attaching a die (11) to a substrate (15) is provided. In accordance with the method, a die and a substrate are provided which are to be connected to each other across first and second surfaces. The first and second surfaces are contacted with a liquid solder composition (21) having a maximum melting temperature Tm1, of less than about 100 C. The liquid solder composition is contacted with a freezing agent (17 or 19) such that a second composition is formed which has a maximum melting temperature Tm2, wherein T2-Tm1 is at least about 25° C. |
申请公布号 |
US6740544(B2) |
申请公布日期 |
2004.05.25 |
申请号 |
US20020145503 |
申请日期 |
2002.05.14 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
STROUSE FLOYD;SHEARER LORI D. CARROLL;BESSER BRANT |
分类号 |
B23K35/00;B23K35/26;H01L21/60;(IPC1-7):H01L21/44 |
主分类号 |
B23K35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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