| 摘要 |
A head chip is manufactured by disposing partition walls made of piezoelectric ceramic between a pair of opposing substrates made of a dielectric material so that the partition walls are spaced apart at a preselected interval to form channels. Inorganic conductive films are formed on a surface of one of the substrates. At least one metal film is formed on a portion of each of the inorganic conductive films. An electrode is formed on a side surface of each of the channels. Each of the electrodes is electrically connected to a respective one of the metal films via a respective one of the inorganic conductive films.
|
