METHOD FOR MANUFACTURING SURFACE MOUNT TYPE ELECTRICAL DEVICE FOR PRINTED CIRCUIT BOARD BY USING THERMOFUSION AND ELECTRICAL DEVICE MANUFACTURED BY THE SAME

摘要

PURPOSE: A method and an electrical device are provided to reduce manufacturing procedures and costs by interconnecting conductive layers through thermofusion. CONSTITUTION: A method comprises a step of preparing a thin film resistor sheet having first and second surfaces(12,14), and first and second conductive layers formed on the first and second surfaces, respectively; a step of pressing the first and second surfaces of the thin film resistor sheet and performing a thermofusion such that the first and second conductive layers contact with each other; a step of forming a plurality of non-conductive gaps(24,34) on the first and second conductive layers; a step of depositing first and second insulating layers(50,52) on the non-conductive gaps and certain parts of the first and second conductive layers; a step of plating the area where the first and second insulating layers are not deposited with solder; a step of cutting the thin film resistor sheet along a thermofusion portion(40); and a step of producing a plurality of electrical devices by dividing the thin film resistor sheet.