| 摘要 |
PURPOSE: A method for filling a via hole of a printed circuit board is provided to allow for formation of fine circuit pattern by permitting the via hole to have a relatively shallow depth. CONSTITUTION: A method comprises a first step of forming a hole(32) penetrating through an upper metal thin film layer(30) and an insulation layer(20) at a base metal(10) which has the upper metal thin film layer and a lower metal thin film layer(30') with the insulation layer interposed between the upper and lower metal thin film layers; a second step of forming a filler layer(34) through a plating process on the lower metal thin film layer exposed within the hole; and a third step of forming a plating layer at the inner wall of the hole and the upper metal thin film layer and electrifying the upper and lower metal thin film layers.
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