发明名称 |
STRUCTURE OF CHAMBER IN INDUCTIVE COUPLING PLASMA ETCHING APPARATUS |
摘要 |
PURPOSE: A structure of a chamber in an ICP(inductive coupling plasma) etching apparatus is provided to reduce the occurrence of defects of a semiconductor device and increase thruput by preventing the polymer generated in an etch process of an etch chamber from being unstably accumulated and by easily generating plasma in a plasma chamber. CONSTITUTION: An etch process is performed in the etch chamber(40). Plasma is generated in the plasma chamber(30). The etch chamber is separated from the plasma chamber by a partition part(20). The partition part confronting the etch chamber is formed of a ceramic material. The partition part confronting the plasma chamber is formed of a quartz material.
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申请公布号 |
KR20040043294(A) |
申请公布日期 |
2004.05.24 |
申请号 |
KR20020071518 |
申请日期 |
2002.11.18 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, DONG BOK |
分类号 |
H05H1/46;H01J37/32;H01L21/3065;(IPC1-7):H01L21/306 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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