发明名称 STRUCTURE OF CHAMBER IN INDUCTIVE COUPLING PLASMA ETCHING APPARATUS
摘要 PURPOSE: A structure of a chamber in an ICP(inductive coupling plasma) etching apparatus is provided to reduce the occurrence of defects of a semiconductor device and increase thruput by preventing the polymer generated in an etch process of an etch chamber from being unstably accumulated and by easily generating plasma in a plasma chamber. CONSTITUTION: An etch process is performed in the etch chamber(40). Plasma is generated in the plasma chamber(30). The etch chamber is separated from the plasma chamber by a partition part(20). The partition part confronting the etch chamber is formed of a ceramic material. The partition part confronting the plasma chamber is formed of a quartz material.
申请公布号 KR20040043294(A) 申请公布日期 2004.05.24
申请号 KR20020071518 申请日期 2002.11.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, DONG BOK
分类号 H05H1/46;H01J37/32;H01L21/3065;(IPC1-7):H01L21/306 主分类号 H05H1/46
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