发明名称 |
CHIP STACK WITH INTERMEDIATE CAVITY |
摘要 |
The invention relates to a method for connecting a connecting surface of a first silicon wafer [WA1] with a connecting surface of a second silicon wafer [WA2] so as to form an insulated cavity after assembly, at least one of the two silicon wafers [WA] including at least one functional area [DA] intended to be within the cavity. The method according to the invention includes a step [PLTS] of depositing alloy soldering bumps [PLTC] on the connecting surface of the first silicon wafer [WA1], said bumps [PLTC] being separated from one another by an even distance which is sufficiently small to cause joinings during the assembly of the two silicon wafers. Said step [PLTS] of depositing the soldering bumps [PLTC] is carried out during the step of depositing the soldering bumps [PLTE] intended for the electrical contacts. The method includes a reflux soldering step [RFX] for assembling the two silicon wafers by melting of the alloy soldering bumps. Application: Protection of semiconductor elements sensitive to the external conditions. |
申请公布号 |
WO03079439(A3) |
申请公布日期 |
2004.05.21 |
申请号 |
WO2003IB00938 |
申请日期 |
2003.03.11 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V.;SIX, JEAN-CLAUDE |
发明人 |
SIX, JEAN-CLAUDE |
分类号 |
H01L25/18;H01L21/60;H01L23/20;H01L23/522;H01L25/065;H01L25/07;H03H3/007;H03H9/10 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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