| 摘要 |
<p>A film carrier tape for mounting electronic components having a large number of wiring patterns of a conductive metal formed on the surface of a long insulating film, characterized in that each wiring pattern is covered independently with a solder resist layer except for the part of connecting terminal, and the solder resist layer formed on the surface of each wiring pattern is divided into a plurality of sections. Warp can be reduced in the film carrier tape for mounting a large number of electronic components cut in the widthwise direction as with the case of CSP, COF, BGA, or the like.</p> |
