发明名称 SEMICONDUCTOR MANUFACTURING FACILITY AND PROCESS SYSTEMS UTILIZING EXHAUST RECIRCULATION
摘要 <p>Apparatus and methods for utilizing recirculated exhaust gas in semiconductor manufacturing systems, in a manner substantially reducing the effluent burden on the exhaust treatment system and infrastructure of the semiconductor process facility. A further aspect relates to a semiconductor manufacturing process facility requiring use therein of air exhaust for its operation, such facility including clean room and gray room components, with the clean room having at least one semiconductor manufacturing tool therein, and wherein air exhaust is flowed through a region of the clean room. The semiconductor manufacturing process facility includes an air exhaust treatment apparatus arranged to (i) receive air exhaust after flow thereof through said region of said clean room, (ii) produce a treated air exhaust, and (iii) recirculate the treated air exhaust to an ambient air environment in the facility, e.g., to the gray room of the facility.</p>
申请公布号 WO2004041415(A1) 申请公布日期 2004.05.21
申请号 WO2003US33548 申请日期 2003.10.22
申请人 ADVANCED TECHNOLOGY MATERIALS, INC. 发明人 OLANDER, W., KARL
分类号 B01D53/74;C23C14/48;C23C14/56;(IPC1-7):B01D53/04 主分类号 B01D53/74
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