发明名称 |
NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
<p>A negative type photosensitive resin composition characterized by comprising an alkali-soluble photosensitive resin (A) having acid groups and having three or more ethylenic double bonds per molecule, an ink repellent (B) comprising a polymer having monomer units (b1) having C20 or lower alkyl in which at least one of the hydrogen atoms has been replaced with a fluorine atom (provided that the alkyl optionally contains ether oxygen) and monomer units (b2) having an ethylenic double bond, and a photopolymerization initiator (C), wherein the ink repellent (B) has a fluorine content of 5 to 25 wt.% and the proportion of the ink repellent (B) is 0.01 to 20 wt.% based on the whole solid components of the negative type photosensitive resin composition. The negative type photosensitive resin composition is excellent in adhesion to substrates, ink repellency, and persistence of the repellency and in alkali solubility and developability.</p> |
申请公布号 |
WO2004042474(A1) |
申请公布日期 |
2004.05.21 |
申请号 |
WO2003JP14019 |
申请日期 |
2003.10.31 |
申请人 |
ASAHI GLASS COMPANY, LIMITED;TAKAHASHI, HIDEYUKI;ISHIZEKI, KENJI |
发明人 |
TAKAHASHI, HIDEYUKI;ISHIZEKI, KENJI |
分类号 |
G03C1/492;G03F7/004;G03F7/027;G03F7/033;G03F7/038;(IPC1-7):G03F7/038 |
主分类号 |
G03C1/492 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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