| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape-like component package and a housing method for electronic components, by which the electronic components can be housed and taken out in a stable manner. SOLUTION: According to the tape-like component package, a plurality of through-holes for housing electronic components are sequentially formed on one surface and the other surface of a tape-like member, on which a first cover tape and a second cover tape are attached, respectively, to cover respective through-holes. A guide slot, having a prescribed width and a depth that is greater than the thickness of the second cover tape, is formed on the other surface of the tape-like member, and the second cover tape is attached to fit to the guide slot. COPYRIGHT: (C)2004,JPO
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