发明名称 |
Micromechanic sensor element, electric circuit and sensor array comprising a plurality of micromechanic sensor elements |
摘要 |
A micromechanical sensor element for recording the bonding of molecules to the micromechanical sensor element. The sensor element having a substrate and at least one electrical terminal. There is also an oscillatable element that is coupled to the electrical terminal in such a manner that an electrical variable that characterizes the oscillation behavior of the oscillatable element may be provided at the electrical terminal. Further, there is a molecule coupling layer, arranged in such a manner that molecules may bond to the molecule coupling layer. The molecule coupling layer is coupled to the oscillatable element in such a manner that bonding of molecules to the molecule coupling layer causes a change in the oscillation behavior of the oscillation element.
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申请公布号 |
US2004093947(A1) |
申请公布日期 |
2004.05.20 |
申请号 |
US20030472632 |
申请日期 |
2003.09.19 |
申请人 |
BREDERLOW RALF;THEWES ROLAND |
发明人 |
BREDERLOW RALF;THEWES ROLAND |
分类号 |
G01N29/00;G01N5/02;G01N27/00;G01N27/02;G01N27/22;(IPC1-7):G01H11/08;G01H1/12 |
主分类号 |
G01N29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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