发明名称 Micromechanic sensor element, electric circuit and sensor array comprising a plurality of micromechanic sensor elements
摘要 A micromechanical sensor element for recording the bonding of molecules to the micromechanical sensor element. The sensor element having a substrate and at least one electrical terminal. There is also an oscillatable element that is coupled to the electrical terminal in such a manner that an electrical variable that characterizes the oscillation behavior of the oscillatable element may be provided at the electrical terminal. Further, there is a molecule coupling layer, arranged in such a manner that molecules may bond to the molecule coupling layer. The molecule coupling layer is coupled to the oscillatable element in such a manner that bonding of molecules to the molecule coupling layer causes a change in the oscillation behavior of the oscillation element.
申请公布号 US2004093947(A1) 申请公布日期 2004.05.20
申请号 US20030472632 申请日期 2003.09.19
申请人 BREDERLOW RALF;THEWES ROLAND 发明人 BREDERLOW RALF;THEWES ROLAND
分类号 G01N29/00;G01N5/02;G01N27/00;G01N27/02;G01N27/22;(IPC1-7):G01H11/08;G01H1/12 主分类号 G01N29/00
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