Method of forming planar Cu interconnects without chemical mechanical polishing

摘要

A method for controlling the shape of copper features, having the following steps: a) plating a copper feature with a predetermined final shape onto a copper seed layer in a plating bath for a first plating time using a first plating method, wherein the first plating time is less than the total length of time necessary to plate the substantially all of the final shape; and b) electrically treating the plated copper feature in a copper plating bath for a second period of time, the second period of time sufficient to at least form the predetermined final shape.