HEAT DISSIPATION SYSTEM OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A heat dissipation system of a semiconductor device is provided to be capable of removing the parasitic capacitance between a heat sink of the semiconductor device itself and an outer heat sink for increasing the tolerance for common mode noise. CONSTITUTION: A heat dissipation system of a semiconductor device is provided with an outer heat sink(40) connected to the semiconductor device for being connected with a ground line, and a conductive part(20) between a heat sink and the outer heat sink for electrically connecting the heat sink with the outer heat sink. The heat dissipation system further includes a heat conductive insulation part(30) inserted between the heat sink and the outer heat sink. Preferably, the conductive part is made of a thin film. Preferably, the thin film has a protrusion for being connected with the heat sink or the outer heat sink.